发明名称 |
ELECTRONIC COMPONENT AND COATING AGENT |
摘要 |
The invention relates to an electronic component comprising, in predetermined areas, soldered regions that are arranged on at least one outer surface, whereby the component is coated on its surface that is not formed by the soldered regions with a layer that prevents the adherence of soldering agents thereto. The invention also relates to a coating agent for reducing the amount of solder tailings. |
申请公布号 |
WO0122501(A1) |
申请公布日期 |
2001.03.29 |
申请号 |
WO2000DE03290 |
申请日期 |
2000.09.21 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG;HOEHN, KLAUS;WAITL, GUENTHER |
发明人 |
HOEHN, KLAUS;WAITL, GUENTHER |
分类号 |
B23K1/00;B23K101/36;H01L23/00;H01L23/12;H01L31/02;H01L33/38;H01L33/40;H01L33/48;H01L33/62;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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