发明名称 ELECTRONIC COMPONENT AND COATING AGENT
摘要 The invention relates to an electronic component comprising, in predetermined areas, soldered regions that are arranged on at least one outer surface, whereby the component is coated on its surface that is not formed by the soldered regions with a layer that prevents the adherence of soldering agents thereto. The invention also relates to a coating agent for reducing the amount of solder tailings.
申请公布号 WO0122501(A1) 申请公布日期 2001.03.29
申请号 WO2000DE03290 申请日期 2000.09.21
申请人 OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG;HOEHN, KLAUS;WAITL, GUENTHER 发明人 HOEHN, KLAUS;WAITL, GUENTHER
分类号 B23K1/00;B23K101/36;H01L23/00;H01L23/12;H01L31/02;H01L33/38;H01L33/40;H01L33/48;H01L33/62;H05K3/34 主分类号 B23K1/00
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