| 摘要 |
PROBLEM TO BE SOLVED: To machine the surface of a wafer uniformly without being affected by the warp of the wafer by providing a plurality of expanding members fitted to the face of a carrier pressing the wafer and independently controllable for expansion and shrinkage. SOLUTION: When the center section of a wafer 3 is protruded upward, piping members 2 at the center portion are applied with a large pressure and expanded, and piping members 2 at the periphery are applied with a smaller pressure and are not expanded. A load F is applied to directly below at the portion of the expanded piping members 2, and no load is applied at the periphery unexpanded portion of the piping members 2. The load adjusted according to the warp state of the wafer 3 or according to the distribution of the required polishing quantity in the plane of the wafer 3 is applied to the wafer 3 to be polished. The surface of the wafer 3 is forced to become flat by the load, and the polishing action of the surface of the wafer 3 is conducted uniformly. When the wafer 3 has an opposite warp, the load applied to the periphery section of the wafer 3 is increased. |
