发明名称 |
Lead frame structure |
摘要 |
A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces. |
申请公布号 |
US6204553(B1) |
申请公布日期 |
2001.03.20 |
申请号 |
US19990371677 |
申请日期 |
1999.08.10 |
申请人 |
WALSIN ADVANCED ELECTRONICS LTD. |
发明人 |
LIU WEN-CHUN;LIU HUI-PING;LIOU JUNG-JIE;PAN YI-HSIANG;TSAI SHENG-TUNG |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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