发明名称 MOLD FOR INJECTION MOLDING AND METHOD FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold for injection molding with a simple structure and wherein cost reduction can be attempted and a method for injection molding. SOLUTION: In this mold, a fixed mold 1 and a movable mold 2 and an intermediate mold 3 between both molds are provided and cavities C1 and C2 are respectively provided between the fixed mold 1 and the intermediate mold 3 and between the intermediate mold 3 and the movable mold 2 and a molten resin is filled into the cavities C1 and C2 by means of a hot runner. The hot runner consists of a main path 4 and a branched path 5 branched from the main path 4 and the main path 4 passes through the fixed mold 1 and the intermediate mold 3 and is communicated with a runner R2 of the cavity C2 of the movable mold 2 and the branched path 5 is communicated with a runner R1 of the cavity C1 of the fixed mold 1.
申请公布号 JP2001018256(A) 申请公布日期 2001.01.23
申请号 JP19990194537 申请日期 1999.07.08
申请人 SEKISUI CHEM CO LTD 发明人 NIIDE TAKESHI
分类号 B29C45/26;(IPC1-7):B29C45/26 主分类号 B29C45/26
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