| 摘要 |
PROBLEM TO BE SOLVED: To expose a metal post and enable fixing a solder ball by covering the surface of a chip containing a wiring layer, and forming an insulating layer composed of thermosetting resin positioned at a lower end than a head part of a metal post by using thermal contraction of a main surface around the metal post which is generated by thermosetting. SOLUTION: When a resin layer R is formed on the whole surface of a chip containing a wiring layer 7, it is suitable that Si3N4 is formed on interfaces between the resin layer R and the wiring layer 7 and between the resin layer R and a metal post 8. Polyimide, epoxy based thermosetting resin and thermoplastic polymer are suitably used for resin constituting the resin layer R. When the resin layer R is cured, it is contracted during curing, and the film thickness is largely reduced. The surface of the resin layer R is positioned at a lower end than a head part of the metal post 8, and the metal post 8 is exposed. The head part of the metal post 8 appears at an end portion of the wiring layer 7, Ni 10 and Au 11 of the head part of the metal post 8 are exposed, and a solder ball 12 is formed on the head part of the metal post 8. |
