| 摘要 |
PROBLEM TO BE SOLVED: To enable the components of an IC package to be protected. SOLUTION: A high-density IC package 30 comprises an opening 86, a first and second surfaces 92 and 94, and a substrate 70. The substrate 70 has a plurality of rooting strips 82 extending into the opening 86. A plurality of pads 100 are disposed on the first and second surfaces 92 and 94 and connected with at least one of the rooting strips 82. A via 84 electrically connects the pad 100 disposed on the first surface 92 with the pad 100 disposed on the second surface 94. A chip 50 is bonded to the substrate 70 having bonding pads 120. A bonding wire 80 electrically connects at least one bonding pad 120 with at least one rooting strip 82. The opening 86 is filled with potting material.
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