发明名称 MULTI-LAYERED FIEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To improve resistance to noise and resistance to static electricity without attaching a countermeasure component such as a shield by forming a low impedance signal pattern having stable voltage over a large area on a part which is not to be used as a wiring pattern on a face opposite to the outer case of an electronic machine. SOLUTION: The multi-layered flexible printed wiring board 2 mounted on a camera body 1 is formed with a solid pattern 2c with a first face opposite to an armor. A foldback 2b is mounted by folding at a fold of a flexible printed substrate 2a. Thus the foldback 2b is facing the camera body 1, and a foldback on a lowermost face is opposite to the case of the camera. A solid pattern on the lowermost and the solid pattern 2c on the first face cause almost all faces of the mounted multi-layered flexible printed wiring board 2 opposite to the case to be a low impedance signal pattern having stable voltage.
申请公布号 JP2000068615(A) 申请公布日期 2000.03.03
申请号 JP19980240113 申请日期 1998.08.26
申请人 CANON INC 发明人 ICHIMASA SHIYOUJI
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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