| 摘要 |
PROBLEM TO BE SOLVED: To provide a stack package and its manufacturing method capable of manufacturing the stack package by using processes for manufacturing a general resin molded semiconductor package and its materials as it is, allowed to be easily applied not only to package development but also to high volume production, and capable of sharply reducing manufacturing cost. SOLUTION: The stack package includes at least two semiconductor chips 10, 10' separately arranged on upper and lower parts. Many bonding pads 10a, 10a' are formed on respective chips 10, 10' along their center parts. The inner leads 21, 21' of 1st and 2nd lead frames 20, 20' are respectively attached to the bonding pad forming surfaces of respective semiconductor chips 10, 10'. The inner leads 21, 2' of respective lead frames 20, 20' are electrically connected to respective bonding pads 10a, 10a' through metallic wires 40, 40'. The inner lead 21 of the 1st lead frame 20 is electrically connected to the 2nd lead frame 20'. The whole stack package is molded with a sealing agent so that a connection part between the 1st and 2nd lead frames and the outer lead of the 2nd lead frame 20' are exposed. |
