发明名称 Method of fabricating a millimeter or submillimeter wavelength component
摘要 A method of reproducing a millimeter or submillimeter wavelength device including forming a master (2) of the millimeter or submillimeter wavelength device, forming at least one mold (20) from the master (2), and forming at least one replica (30) of the millimeter or submillimeter device using the mold (20). The master (2) is made by forming connector ports (2a), channels (2e) and grooves into a block of solid material, providing a backshort (2c) in the appropriate locations, and providing a thin protective coating layer (2j) if necessary. The master (2) is optimized for the production of precision waveguide structures with unique features such as rounded edges, tapered sidewalls and the absence of features which would inhibit the easy release of the master (2) or cast replica (30). The mold (20) is formed by providing a cavity with a baseplate (6) which is attached to the master (2), and pouring a mold resin into the cavity surrounding the master (2). The mold (20) is cured and the master (2) is extracted from the cured mold resin. The replica (30) is formed by pouring a casting resin into the mold (20), curing the resin and removing the replica (30) from the mold. A metalization layer is then added to internal surfaces of the replica (30) and two mirror image replicas are joined so as to form a complete millimeter or submillimeter device.
申请公布号 AU6772998(A) 申请公布日期 1998.10.20
申请号 AU19980067729 申请日期 1998.03.25
申请人 THE UNIVERSITY OF VIRGINIA PATENT FOUNDATION 发明人 WILLIAM L. BISHOP;THOMAS W. CROWE;JEFFREY L. HESLER;PHILIP J. KOH;ROBERT M. WEIKLE;PERRY WOOD
分类号 B29C33/38;H01P11/00 主分类号 B29C33/38
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