| 摘要 |
<p>PROBLEM TO BE SOLVED: To mount components at a high density and to prevent mounting fault of the components by charging a filler having satisfactory wettability with solder in a non-penetrating connecting hole, and forming a surface of the filler and a surface of an outer layer circuit in the same height. SOLUTION: A mask covering except a non-penetration connecting hole 15 is formed, epoxy resin is charged as a filler 17 in the hole 15. When it is solidified, and a part protruding from the hole 15 is polished, so that a surface of the filler 17 becomes the same height as a surface of an outermost layer mounting circuit 14a. Then, plating layers are formed on the filler 17 and the circuit 14a, and conductor films 18 are formed on the circuit 14 and filler 17 by etching. Thus, since the component is not mounted obliquely on a component land, a contact fault can be prevented, and mounting density of the components can be enhanced.</p> |
