| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely adsorb a thin wafer and hold it so that it may be not cracked even when it is chucked by the sucking action at the time of transfer and the wafer may be quickly and surely separated when the sucking action is released in a chucking device which chucks and transfers the semiconductor wafer. SOLUTION: This is a chucking device to be used at the time of transferring a semiconductor wafer and the semiconductor wafer has a flat chucking face sucking and holding the semiconductor wafer and suction region 28 is formed on the suction region 28 and a non-suction region 29 is formed on its outer periphery and a plurality of unevenness are formed on the suction face. Even in the case of a substrate of a chucking type on the whole surface of the wafer, no influence of surface tension such as cutting water is excerted due to a plurality of formed unevenness, thus allowing sure separation of the wafer when the sucking action is cancelled.</p> |
