Surface mount semiconductor package

摘要

A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastics material body (10). Electrical control connections to the semiconductor comprise first and second upstanding legs (12,14) which are offset from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads (16,18). The pads may be partially sheared, to step them, thereby allowing a single thickness leadframe to be used in the manufacture of the device. On the lower face of the body (10) there are channels (22,24) which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.