| 摘要 |
The package comprises a lead frame 5 having connection leads, a conductor layer 2 coupled to the lead frame and at least one electronic device (not shown) having a number of terminals connected to the conductor layer. A heatsink 4 is coupled via a dielectric layer 3 to the conductor layer, for providing a heat dissipation path away from the conductor layer. The electronic device may be an integrated circuit which is connected to conductor layer 2 by soldering or by using a conductive adhesive. |
