| 摘要 |
A pin-grid array with a cooling structure includes a substrate. A cavity is provided in the upper surface of the substrate. An electrical device (3) (e.g., a large-scale integrated circuit) is placed in the cavity of the substrate (1) and leads (4) connect the substrate (1) and the LSI (3). A cap (6) covers the cavity and a heat sink (7) is attached to the cap (6). A heat conductive material (5) is filled between the LSI (3) and the cap (6). The material (5) conducts the heat generated by the LSI (3) to the cap (6), and then to the heat sink (7). Pins (16) are arranged across substantially the entire lower surface of the substrate (1). A bent portion of the cap (6) protrudes toward the LSI (3). The bent portion narrows the gap between the cap (6) and the LSI (3). An insulating film (4a) is provided between the leads (4) and the cap (6) for preventing a short-circuit. |
