| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject member capable of suppressing the amount of an evaporated gas to an extent not soiling the surface of a silicon wafer, and high in strength and heat resistance by using a thermoplastic polyester resin having a specific amount of a vaporized gas generation at heat-treatment thereof and of an alkali metal elution. SOLUTION: This silicon wafer carrier capable of suppressing the amount of an evaporated gas generation and an alkali metal elution to an extent not soiling the surface of the silicon wafer, and high in strength and heat resistance, is obtained by melting and kneading a thermoplastic polyester resin having <=200ppm amount of vaporized gas generated by a heat-treatment at 150 deg.C for 60min and <=10ppm amount of a clubed alkali metal by an immersion treatment in an ultrapure water at 80 deg.C for 120min (e.g.; polybutylene terephthalate) by an extruder at 260 deg.C at 160rpm number of screw rotations and at 50kg/hr extrusion rate, cooling the thread extruded from a die, cutting to form pellets for a molding, and then injection molding the pellets at 250 deg.C cylinder temperature and 60 deg.C mold temperature.</p> |
