发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device wherein the dissolving of a problem of uniformity of film quality of a polycrystalline silicon film in a low temperature process, the improvement of annihilation ratio of crystal defect, the improvement of characteristics of a thin film transistor, and the uniforming of characteristics in a substrate are possible. SOLUTION: An amorphous silicon film 12 is doped with fluorine before crystallization of a polycrystalline silicon film 13 not through an oxide film, before an element isolation process, by combining laser annealing with fluorine doping. After that, crystallization of the amorphous silicon film 12 and activation of fluorine are simultaneously performed by laser annealing. Thereby crystal defect in an active layer film 14 is annihilated, and characteristics of film quality is improved as a whole. Hence, the problem of uniformity of film quality of the active layer film 14 is dissolved, and excellent characteristics of a polycrystalline silicon thin film transistor in a low temperature process can be obtained in a large-sized substrate without irregularity.</p>
申请公布号 JPH09102612(A) 申请公布日期 1997.04.15
申请号 JP19950260385 申请日期 1995.10.06
申请人 TOSHIBA ELECTRON ENG CORP;TOSHIBA CORP 发明人 HINO TAKASHI
分类号 G02F1/136;G02F1/1368;H01L21/265;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L29/786 主分类号 G02F1/136
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