| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. excellent in photo-setting property and resolution, less liable to the reduction of film thickness after heat treatment and excellent in heat resistance and to produce a heat resistant relief polymer pattern excellent in heat resistance, mechanical and electrical characteristics. SOLUTION: This compsn. contains a polymer having repeating units each contg. a nitrogen-contg. hetero ring, at least one of org. carboxylic acid having an olefinic double bond and org. sulfonic acid having an olefinic double bond and at least one of a photopolymn. initiator and an azido compd. This compsn. is applied on a substrate, dried, irradiated with light through a photomask, developed with a developer and heat-treated to produce the objective heat resistant relief polymer pattern. |
