| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state image sensing device for an electron endoscope wherein miniaturization is enabled and reliability is improved. SOLUTION: In device holes 5, 6 of a TAB tape 1, a solid state image sensing element 2 and a semiconductor element 3 are connected to an inner lead 7 and mounted on the TAB tape 1. A TAB tape part 1a on which the inner lead 7 is arranged is cut, the solid state image sensing element 2 and the semiconductor element 3 are separated form the TAB tape 1, the inner lead is bent, and the solid state image sensing element 2 and the semiconductor element 3 are overlapped and three-dimensionally arranged. A fixing part 12 of an external signal line 11 is connected to the surface of the semiconductor element 3. The whole body is covered with sealing resin 13, and a solid state image sensing device for an electron endoscope is constituted. |
