Wasserkissenvorrichtung zum Halten von Wafers die einer chemisch-mechanischen Politur unterzogen werden

摘要

A wafer polishing fixture is disclosed containing a first liquid film (6) confined by a non-porous but flexible enclosure (2,8) for distributing evenly the applied polishing forces across the surface of a wafer (7) supported by the confined liquid (6). The fixture comprises a flexible, non-porous template (2) with a pocket (5) for receiving a wafer (7) to be polished. A washer (4) is placed between a carrier (3) and the template pocket (5). A film of water (6) fills the bottom of the pocket (5) and is confined with the aid of the washer (4) and by an overlying porous pad (9) extending across the pocket (5) and having a non-porous sheath (8) facing the liquid (6). A second liquid film (10) saturates and covers the upper surface of the pad (9). The wafer (7) to be polished floats upon the second liquid film (10) within the pocket (5).