METALIZING METHOD OF SEMICONDUCTOR DEVICE

摘要

forming insulating film having a contact part on a semiconductor substrate; forming the first metal layer on a lower film exposed to the inner contact part and the contact at a temperature of less than two hundred centigrades; forming a metal plug in th contact part by fusing the first metal layer; forming the second metal layer at front side of the semiconductor substrate where the metal plug is formed; heat processing the second metal layer.