发明名称 METHOD AND EQUIPMENT FOR PROCESSING PRINTED CIRCUIT BOARD, ETC.
摘要 PURPOSE: To appropriately treat an article where thickness changes for each part of a printed-circuit board or the like by a fluid-treating device such as an air knife. CONSTITUTION: A device is provided with a first conveyor means 30 that is engaged to the lower surface of an article 81, a second conveyor means 50 that is engaged to the upper surface of the article, and a fluid-treating means for performing the fluid treatment of the article in a fluid-treating device. Then, the fluid-treating means is provided with a means for unloading treatment fluid through a delivery port 90 of a fluid delivery pipe, a following means for allowing the fluid delivery pipe to follow one conveyor means 50 that is adapted to a different thickness in vertical direction at each portion of the article and for adapting the delivery port of the fluid delivery pipe essentially to different thickness in a vertical direction at each part of the article, and a means for automatically rotating the fluid delivery pipe by the amount corresponding to the different thickness in a vertical direction at each part of the article.
申请公布号 JPH07294124(A) 申请公布日期 1995.11.10
申请号 JP19950033449 申请日期 1995.02.22
申请人 ATOTETSUKU U S EE INC 发明人 POORU DABURIYU SHIKARERII;CHIYAARUZU SHIIGAA JIYUNIA;RITSUKII HAIMUSU
分类号 B08B3/02;B23K1/012;F26B15/18;F26B21/00;H05K3/00;H05K3/06;H05K3/22;H05K3/26;(IPC1-7):F26B15/18 主分类号 B08B3/02
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