| 摘要 |
PCT No. PCT/GB92/01513 Sec. 371 Date Jan. 7, 1994 Sec. 102(e) Date Jan. 7, 1994 PCT Filed Aug. 17, 1992 PCT Pub. No. WO93/04014 PCT Pub. Date Mar. 4, 1993.Dispersions of sinterable powder, for example, of metal or high-melting-point non-metal such as silicon, or a ceramic substance such as silicon carbide, silicon nitride or alumina, are hot injection-molded using a dispersion of the sinterable material in a binder which, like the dispersion, is solid at room temperature and fluid at the temperature of molding, forming a molded product of uniform density. The binder employed contains polystyrene, which forms the predominant weight proportion of the binder, and in lower weight proportion, an organic compound, e.g., diphenyl carbonate, which is solid at room temperature, is soluble in the molten polystyrene, and is more soluble than the polystyrene is in a lower aliphatic alcohol or ketone. After molding, the binder is removed in non-solid form as vapor, or by dissolution in a solvent, or by oxidation to volatile materials, to leave a porous structure of uniform density.
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