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发明名称
PACKING METHOD FOR INNER LAYER CIRCUIT CONTAINED MULTILAYER PRINTED CIRCUIT BOARD SUBSTRATE
摘要
申请公布号
JPH0752910(A)
申请公布日期
1995.02.28
申请号
JP19920237549
申请日期
1992.07.21
申请人
RISHO KOGYO CO LTD
发明人
OKAJIMA KIYOSHI
分类号
B65B23/00;B65D85/86;H05K3/46;(IPC1-7):B65B23/00
主分类号
B65B23/00
代理机构
代理人
主权项
地址
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