MANUFACTURE OF MULTILAYER WIRING BOARD

摘要

PURPOSE:To provide a method of manufacturing a multi-layer wiring board having extremely high electrical reliability upon an insulating layer formed on the roughened surface of an insulating substrate within said manufacturing method including the steps of physically roughening the surface of the insulating substrate with wiring patterns formed thereon so as to form the insulating layer. CONSTITUTION:As for the manufacturing method of multilayer wiring board including the step of forming an insulating layer on an insulating substrate with wiring patterns formed thereon, after physically roughening the surface of the insulating substrate including the wiring patterns, the roughened surface is cleaned up by bringing it into high pressure contact with a non-conductive solution further to form the insulating layer.