| 摘要 |
PURPOSE:To provide a semiconductor device having low decrease in heat dissipation by connecting a metal board to be connected through a first heat sink to a second heat sink by mechanical connection means or adhesive. CONSTITUTION:A semiconductor element 1 is electrically connected to a semiconductor element control circuit 10 via a connecting wire 7a, and electrically connected to the control circuit 10 via a connecting wire 7b through a solder layer 3a, a first heat sink 2, a solder layer 3b and a conductor layer 12a. Accordingly, heat generated from the semiconductor 1 is sequentially transferred through the layer 3a, the sink 2, the layer 3b, the layer 12a, an insulating layer 12b, and a metal plate 12c to a second heat sink 14 to be dissipated. Since the plate 12 is connected to the sink 14 by caulking of a protrusion 14a, the element 1 is cooled without decrease in heat dissipation due to thermal fatigue at the connected part. |
