发明名称 Lötvorrichtung und Verfahren unter Verwendung eines erwärmten Gases an einer Lotlegierung für eine zusammenzulötende Teileanordnung.
摘要 Soltering method, particularly well suited for the soldering of chips by means of soldering alloys. It pertains to the microelectronics world, and more specifically to that of the soldering of microelectronic devices by means of soldering alloys, finding application in microelectronics and particularly in the assembly of circuit and microwave componemts. The system consists of a nozzle (2) crossed by a die collet (5,6) and the unit forms a flow of gas in the shape of a ring. <IMAGE>
申请公布号 DE69100548(D1) 申请公布日期 1993.12.02
申请号 DE1991600548 申请日期 1991.03.24
申请人 SELENIA INDUSTRIE ELETTRONICHE ASSOCIATE S.P.A., ROM/ROMA, IT 发明人 MORETTI, SERGIO, I-00010 ROMA, IT;FRACASSI, UGO, I-00172 ROMA, IT
分类号 B23K1/00;B23K3/047;H01L21/60;(IPC1-7):B23K3/047 主分类号 B23K1/00
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