| 摘要 |
PURPOSE:To provide a mold for the resin sealing of a semiconductor device improved in the mutual compatibility and adhesion of the mating surfaces of upper and lower molds and capable of certainly preventing the generation of flash in the resin sealing of the semiconductor element assembled on a lead frame by a transfer mold. CONSTITUTION:A mold 10 for the resin sealing of a semiconductor device is equipped with upper and lower molds 12, 14 and used for the transfer molding of the semiconductor element assembled on a lead frame. A thin upper mold plate-shape block 20 having a cull part 22 and a cavity part 24 integrally formed thereon is mounted on the lower mold 14 so as to freely approach the upper mold and elastically pressed in the direction separated from the upper mold by columnar pillars 28 constituted of an elastic structure When the mold is closed by pressing the lower mold by the upper mold plate-shape block, the mating surface of the upper mold plate-shape block is complemented with the mating surface of the lower mold. The thickness of the upper mold plate-shape block is made sufficiently thin to deform the block by clamping force and pref. set to 8-20mm. |
