发明名称
摘要 PURPOSE:To enhance lightweightness, abrasion resistance, strength or the like, by a construction wherein a cover layer of gold or a gold alloy is provided on a part or the entire part of the surface of a wire of Ti or a Ti alloy, and a hard solder is adhered to one end part of the wire. CONSTITUTION:The cover layer 3 of gold or a gold alloy is provided by plating, cladding, thermal spraying or other means on the surface of the wire 2 made of Ti or a Ti alloy and having a diameter of about 0.3mm. Next, a hard solder 4 such as silver hard solder and German hard solder is adhered to onened part of the wire 2 to produce a wire 1 for a dot printer. The cover layer 3 may cover either the entire part or a part of the surface of the wier 2. The wires 1 are connected to an electromagnetic driver through the hard solder 4, and the tips of the wires 1 are so located as to face to a platen 7.
申请公布号 JPH0412229(B2) 申请公布日期 1992.03.03
申请号 JP19840231255 申请日期 1984.11.05
申请人 TANAKA KIKINZOKU KOGYO KK;NISHIHATA MIKIO 发明人 NISHIHATA MIKIO;TAKARASAWA KATSUYUKI
分类号 C25D7/00;B21F45/00;B41J2/25 主分类号 C25D7/00
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