| 摘要 |
<p>PURPOSE:To prevent failures due to defects such as lamination defect, transformation, disconnection, line short-circuiting, and withstand voltage deterioration which are derived from smear for the cause by providing a minimum recessed part which is capable of carrying wafers or a sucking hole exclusively for carrying at one part where no elements are formed on at least one surface of a surface and a rear surface of a semiconductor wafer. CONSTITUTION:At least on minimum recessed part which can carry a wafer or a sucking hole 3 exclusively for carrying are provided at a location where no elements are formed on at least one of the surface and the rear of a semiconductor wafer 1. In this case, when carrying a silicon wafer within a process, a teflon chuck, etc., is hit against only a sucking hole exclusively for carrying and is sucked by vacuum. Therefore, the contact location is limited to the sucking hole 3 exclusive for carrying, thus preventing smear from reaching other parts (element-forming part). Therefore, failures due to defects such as lamination defect, line short-circuiting, and withstand voltage deterioration can be prevented.</p> |
