| 摘要 |
Multilayer printed circuits, and methods for their fabrication, are provided, characterized in that the conductive circuitry of the circuitry innerlayers is built up from electroless copper, and the surfaces of the electroless copper which confront the sandwiching pre-preg resin layers are provided with a tin coating to promote adhesion of the electroless copper to the pre-preg resin layers. The invention is particularly suitable for preparing multilayer circuits having buried through-holes.
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