Single-sided polished semiconductor disc mfg. system - uses upper and lower polishing surfaces for polishing opposing pairs of discs

摘要

The disc mfg. system uses dual-sided chemomechanical polishing, with upper and lower polishing surfaces supplied with a polishing medium. The surfaces are moved relative to a rotor disc incorporating openings into which the semiconductor discs to be polished are fitted. The semiconductor discs are fitted in these openings in pairs with the rear faces in contact, so that the front faces of the two discs are polished by the upper and lower polishing surfaces respectively. A fluid layer is inserted between the opposing rear faces of the discs. ADVANTAGE - Efficient semiconductor disc polishing.