| 摘要 |
PURPOSE:To enable a semiconductor element to be bonded constantly at the optimum status feeling no effects of any surface status or external turbulence by feedback-controlling the oscillation output and time of ultrasonics. CONSTITUTION:When bonding process advances to raise a defective output wave form 8, the wave form 8 is digital-sampled by an AD conversion circuit 3 to be compared with an optimum output wave form 7 set up by an optimum wave form setting up circuit 5 while the difference in the output value at the time T1 Y2-Y1 is computed by a comparison circuit 4 to feed back the value to an oscillation output time setting up circuit 1 for automatically changing the oscillation output as for the feedback control for approximating the defective wave form 8 to the optimum wave form 7. Furthermore, any defective bonding process such as wire falling off etc., can be detected by computing any impressed energy value to check if the value is abnormally high or not. |
