| 摘要 |
PURPOSE:To inhibit the occurrence of unevenness in the concn. and pH of a plating soln. by spraying a plating soln. for supply on the surface of the plating soln. during electroless plating. CONSTITUTION:A plating soln. 50 is fed to a heating tank 90 through a circulation system 60, heated to a prescribed temp. with a heating element 80 and fed to a main plating tank 100 through a filter medium 130 on the top of a wall 120. In the tank 100, members 20 to be plated are subjected to electroless plating with the soln. 50. The soln. 50 flows in a supply tank 110 through a space under a wall 140, returns to the system 60 through a discharge hole 150 and repeats circulation. The concn. and pH of the circulating plating soln. 50 are measured by analysis with an analyzer 180. In a supply system 70, a soln. 200 for supply is sprayed from a spraying part 210 on the surface of the plating soln. 50 in the supply tank 110. The soln. 200 is dispersed at once over a wide range of the soln. 50, the occurrence of unevenness in the concn. and pH of the soln. 50 is inhibited and a plated layer of a uniform thickness is formed. |
