发明名称 COMPOSITION FOR CONDUCTIVELY ANISOTROPIC HEAT SEALING, ITS MANUFACTURE AND ITS USAGE
摘要 PURPOSE:To obtain a composition with hot-contact bonded dry coating film therefrom conductively anisotropic and heat-sealable, comprising conductive fine powder such as graphite one, hot-contact bonding polymeric binder and solvent. CONSTITUTION:The objective composition, i.e. a suspension with an apparent specific gravity 0.7-2.0 and viscosity 50-1,500 poises, can be obtained by mutually mixing the following components into a homogeneous dispersion: (A) 0.5- 20wt% of conductive fine powder consisting of at least one sort of matter selected from graphite, silver, copper and nickel powder with a size 0.5-4mu and carbon black powder with a size <=0.1mu, (B) 5-60wt% of hot-contact bonding polymeric binder (made up of at least one sort of polymer selected from chloroprene synthetic rubber and ethylene-vinyl acetate copolymer resin), (C) 30- 90wt% of a solvent consisting of at least one sort of solvents selected from isophorone, diacetone alcohol, methyl isobutyl ketone, xylenes, toluene, etc. and, if necessary, (D) 0.5-15wt% of tackifier (e.g. terpene resin, aliphatic hydrocarbon resin).
申请公布号 JPS60133054(A) 申请公布日期 1985.07.16
申请号 JP19830228457 申请日期 1983.12.05
申请人 NIHON KOKUEN KOGYO KK 发明人 MURATA KATSUHIRO;SHIBATA MITSUMASA;UNO KIYOUJI
分类号 C08K3/00;C08K3/02;C08K3/04;C08K3/08;C08K5/00;C08L101/00;H01B1/20;H05K3/32 主分类号 C08K3/00
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