| 摘要 |
PURPOSE:To prevent short circuit failure due to wire touch by bonding a wire formed of high-purity copper and coated with resin on the surface thereof to the electrode of a pellet and an external terminal, respectively. CONSTITUTION:A wire 6 connecting the bonding pad 8 of a pellet 3 and the inner lead portion 5 of a lead is formed of copper 6a having 99.99wt% or higher purity, and has been previously coated with a resin layer 6b of urethane resin on the surface thereof. Bonding of the wire 6 to the bonding pad 8 of the semiconductor pellet is performed by the so-called ball bonding method. Since the wire 6 is coated with urethane resin having insulating properties, even if the wire 6 touches another wire, a pellet corner or the like, namely wire touch occurs after the bonding is completed, the occurrence of short circuit failure can effectively be prevented. |
