| 摘要 |
PURPOSE:To improve the utilization efficiency of a sealed material by the enhancement of moisture resistance by a method wherein a lead frame connected to the surface electrode of an element with a fine wire is sealed in powder coating by a fluid dipping method. CONSTITUTION:The lead frame 2 with a semiconductor element 1 fixed and wire-bonded is pre-heated to 100-200 deg.C and then dipped in a fluid dipping bath 4. The bath 4 has the powder of the sealed material 3 placed over a porous plate 5 therein, further the material 3 being in fluid state because of high pressure air introduced from a high-pressure air introduction port 6. After dipping, the lead frame is pulled up and heated intermediately to 100-200 deg.C and thereafter dipped again. In repetition of this process several times, the material 3 is applied to the lead frame 2 to a required thickness and then post-cured at 100- 200 deg.C. |
