| 摘要 |
PURPOSE:To obtain a cooling structure of a low thermal resistance whereby a large amount heat generated from IC's is exhausted outside a device without interposing air by a method wherein bellows installing surfaces and IC mounting surfaces of a substrate are opposed to each other and fixed on the substrate, the closed end surface of each bellows is pressure-welded to the corresponding IC, and the IC's are cooled by making a coolant flow through a hermetic space. CONSTITUTION:The substrate 1 is so fixed that the IC2 comes on the side of a cooling plate 6 by means of a lock fittings 8 and screws 12. This cooling plate 6 has connecting holes bored at positions corresponding to the IC's 2 on the substrate 1, and the open side of the bellows 3 with one end closed and the other end opened is hermetically sealed and joined to the substrate 1 side of the connecting hole 11. The closed end of this bellows 3 is worked with good accuracy, and closely contacts the upper surface of the IC2 by utilizing the elastic deformation in the axial direction of the bellows and thus pushing down the IC2 by suitable force. Further, a groove 5 which has a coolant injection port 9 and a coolant exhaust port 10 and constitutes a flow path so that the injected coolant passes through all the connecting holes 11 and is exhausted out of the exhaust port 10 is formed on the opposite surface side of the cooling plate 6. Moreover, a cap 7 is hermetically joined to the cooling plate 6, and accordingly the leakage of the coolant is prevented. |
