INSPECTION OF SOLDER JOINTS BY ACOUSTIC IMPEDANCE

摘要

INSPECTION OF SOLDER JOINTS BY ACOUSTIC IMPEDANCE A method for detection of unacceptable solder joints, especially solder pads on printed circuit boards (PCBs), by means of the application of acoustic vibrations over a range of frequencies to the solder joint and observation of the acoustic impedance of the joint as reflected back through the driver to the acoustic generator or through an acoustic detector near the generator to electrical detecting means.