| 摘要 |
PURPOSE:To contrive that the wafer surface is not subject to damages in a later polishing process by a method wherein a sheet is adhered to a wafer by a pressing roller in a state that the wafer and the sheet are adsorbed on a stage, thus the sheet generates no positional displacement and entirely covers the wafer surface. CONSTITUTION:On the stage 14, the wafer 12 is supplied and simultaneously positioned, and thereafter the wafer 12 is adsorbed and fixed by operating a vacuum source. When the wafer 12 is fixed, a punching die 26 descends, and succedingly a punch 29 descends, puches the standby sheet 17, makes the punched sheet 17 descend along a punching hole 27 and softly mounts it on the upper surface of the wafer 12. Next, when the punhcing die 28 and the punch 29 ascend, the stage 14 is sent to a pressing process in a state that the wafer 12 and the sheet 17 are adsorbed. Thereat, the sheet 17 is pressed by the pressing roller 18, and accordingly the sheet 17 is adhered on the surface of the wafer 12. Thus, successively the sheet 17 is adhered on the surface of the wafer 12 continuously and sent to the later polishing process. |
