发明名称 BONDING METHOD
摘要 PURPOSE:To widen the selecting range of the material of an article to be bonded as well as the configuration of bonding part and permit a mold to cope with many configurations without employing special parts by a method wherein a mold for heating, which is constituted of a heating medium generating heat by high-frequency induction, is pushed against the article to be bonded directly or indirectly, thereafter, heat is generated through the mold. CONSTITUTION:When an article to be bonded is constituted of two sheets of polyethylene resin 1 and the tube 2 of polyethylene resin, which is inserted into the sheets, the supporting body 4 of a mold 3 for heating is made by an artificial slate, hardly absorbing or reflecting high-frequency wave and provided with a resistance to heat. The mold 3 is provided with a recess 6 along a bonding part. The surface of respective supporting bodies 4, which is at the side of the article to be bonded, is coated with a heating medium 5 such as nickel for example, which generates heat by high-frequency induction. The article to be bonded is pinched by the molds 3 through thin heat resistant sheets 8 or the Teflon coating glass cloth of the thickness of 0.13mm substantially and the molds 3 are passed below a high-frequency induction coil 9 while pressing the molds against each other. According to this method, the sheets with each other and respective sheets and the tube may be sealed by heat without generating any gap or pinhole.
申请公布号 JPS62261423(A) 申请公布日期 1987.11.13
申请号 JP19860105299 申请日期 1986.05.08
申请人 YOSHIDA TAKAO 发明人 YOSHIDA TAKAO
分类号 B29C65/00;B29C65/04;B29C65/18;B29C65/32;B29C65/36 主分类号 B29C65/00
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