发明名称 Pin for brazing to a substrate and improved package resulting therefrom
摘要 A pin designed to be attached to a solid state module for making connection between the module and other parts of a metallurgical system. The end of the pin that is to be brazed to the module has a sloping (e.g., conical or wedge) shaped head so that gas bubbles can readily escape during brazing, thus reducing voids in the braze.
申请公布号 US4360289(A) 申请公布日期 1982.11.23
申请号 US19800164643 申请日期 1980.06.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CAMMARANO, ARMANDO S.;DIGIACOMO, GIULIO
分类号 H01L23/50;H01L21/48;H01L21/60;H01L23/498;H05K3/34;(IPC1-7):B25G3/34;F16B11/00;F16B12/04;F16L13/00 主分类号 H01L23/50
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