发明名称 |
Pin for brazing to a substrate and improved package resulting therefrom |
摘要 |
A pin designed to be attached to a solid state module for making connection between the module and other parts of a metallurgical system. The end of the pin that is to be brazed to the module has a sloping (e.g., conical or wedge) shaped head so that gas bubbles can readily escape during brazing, thus reducing voids in the braze.
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申请公布号 |
US4360289(A) |
申请公布日期 |
1982.11.23 |
申请号 |
US19800164643 |
申请日期 |
1980.06.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMMARANO, ARMANDO S.;DIGIACOMO, GIULIO |
分类号 |
H01L23/50;H01L21/48;H01L21/60;H01L23/498;H05K3/34;(IPC1-7):B25G3/34;F16B11/00;F16B12/04;F16L13/00 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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