| 摘要 |
<p>PURPOSE:To prevent the occurrence of the defect and the exfoliation of a resist, and to eliminate the deterioration of the characteristic of an electronic component by treating the surface of a substrate including a circuit function section with silane coupling agent or silicon primer and coating it with plating resist. CONSTITUTION:Base electrodes 5, 5, 6 for forming terminal electrodes are formed by printing, baking silver paste at the end of a substrate 1. The substrate 1 is dipped in a silane coupling agent. i,e., dipropyltrimethoxysilane diluted to 0.01-2% with ethanol as the diluent in the previous step of barrel-plating the electrodes 5, 5, 6, and dried. Then the substrate 1 is coated with plating resist except the electrodes 5, 5, 6, and a resistor 2 and a collector electrode 3 are masked. Thus, the substrate 1 masked by the plating resist is contained in a barrel plating vessel, nickel-plated 2mum thick, then tin-plated 3-4mum thick, totally barrel-plated for 90min, and the two plating layers are formed on the electrodes 5, 5, 6 as terminal electrodes.</p> |
