| 摘要 |
PURPOSE:To improve a semiconductor device in wet and heat resistances by soldering a semiconductor piece that exposes its p-n junction onto a case-shaped electrode, and providing glass material around the piece. CONSTITUTION:A case-shaped electrode 1 is made of a Cu-C alloy containing 30% C, and glass 6 is made by sintering powder comprising 60wt% Zn, 20wt% B2O5, 8wt% SiO2, 4.85wt% Pb0 and a trace of the other constituents. An electrode 3 is mede of W, and the soldering material is solder containing 93.5% Pb, 5% Sn and 1.5% Ag. The constitution permits the thermal expansion difference between the parts including an Si piece 2 to be small, so that there are few possibilities of the breakage of each parts in sintering glass or due to the change of the working environment. Consequently, a semiconductor device having excellent heat and wet resistances is obtained. |
