SEALING METHOD OF SEMICONDUCTOR DEVICE,申请号JP19770025964-传众专利搜索

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发明名称	SEALING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS53112062(A)	申请公布日期	1978.09.30
申请号	JP19770025964	申请日期	1977.03.11
申请人	HITACHI LTD	发明人	KANEYA AKIO
分类号	H01L23/04;H01L21/50;H01L23/02	主分类号	H01L23/04
代理机构		代理人
主权项
地址

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