| 摘要 |
PURPOSE:To make it possible to perform efficient probing, by making the value of a second-probe size smaller than the value of the diameter of a wafer to be measured, dividing the wafer into an inner area and an outer area with respect to the second-probe size, and specifying the areas for probing. CONSTITUTION:As a second-probe size, a diameter, which is smaller than a wafer size R of a wafer 1, is specified as the second-probe size (r). When IN is specified for a probing area, an area 11 inner than the second probing size (r) of the wafer 1 is probed. when OUT is specified, an outer area 12 is probed. The yield rate in sample probing is judged. On the basis of the result, the probing of the specified area is performed. Therefore, the probing can be carried out efficiently in correspondence with the quality characteristics of the wafer.
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