Method and apparatus for wafer backgrinding and edge trimming on one machine

摘要

A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.

主权项

1. A workpiece processing apparatus, the apparatus comprising:
a rotary turntable configured to rotate about a turntable axis; a workpiece spindle on the turntable, the workpiece spindle being configured to secure a workpiece thereon, the workpiece spindle being configured to rotate about a workpiece spindle axis independently of the rotation of the turntable; and a grind spindle, the grind spindle being configured to overlay the turntable and functionally engage the workpiece when rotated thereunder; wherein the apparatus is configured to transition between a first operational state and a second operational state, and wherein in the first operational state the turntable is configured in a first position to center the workpiece spindle and the workpiece thereon under the grind spindle so that the grind spindle may condition an entire front surface of the workpiece, and wherein in the second operational state the turntable is in the same position as in the first operational state and wherein the grind spindle is linearly moved perpendicular to its grind spindle axis, wherein position between the turntable axis and the grind spindle axis is changed to offset the grind spindle and the workpiece.