| 摘要 |
The present invention relates to a rework system which has a form of BGA or SMD and has semiconductor components and a PCB undamaged by the temperature of hot air, as well as is used in melting a parent metal like soldering used in bonding and comprises a pump for discharging warm air, a warm-air temperature sensor, a triac element gate, a nichrome heater and a power source. The rework system according to the present invention comprises: a pump operation circuit for controlling operations of the pump for discharging warm air; a warm-air temperature sensor amplification circuit using a differential input operational amplifier to enhance sensibility of the warm-air temperature sensor; a gate operation circuit for operating the triac element gate; a nichrome heater controller for adjusting an amount of heating of the nichrome heater; an LCD module for displaying information such as a work situation, the warm air temperature and the like; an MCU for controlling the components above; and an input button for inputting control information to the MCU. |
