METHOD FOR PLATING SUBSTRATE AND APPARATUS

摘要

The present invention is to provide a copper damascene plating method for efficiently filling fine wiring trenches and via holes formed in a surface of a substrate without using special machines or electrical facilities, while preventing from generation of air bubbles. The plating method for filling trenches or via holes formed in a surface of a substrate with copper plating, comprises: performing electrolytic plating using a plating solution comprising copper sulfate (CuSO4.5H2O) having a concentration of 4-250 g/l, sulfuric acid (H2SO4) having a concentration of 10-200 g/l, and chlorine ions having a concentration of 0-100 mg/l. In addition, a sulfur compound additive can be mixed in to make the solution more suitable for copper damascene plating, wherein the concentration of the additive is selected based on the ratio of sulfuric acid/hydrated copper sulfate.