发明名称 SUBSTRATE INSPECTION DEVICE, SUBSTRATE INSPECTION METHOD AND JIG FOR SUBSTRATE INSPECTION
摘要 PROBLEM TO BE SOLVED: To provide a highly efficient substrate inspection method for determining quality of wiring formed on a substrate by using a TDR measurement method.SOLUTION: A substrate inspection device is provided which includes: power supply means for supplying an inspection signal for TDR measurement for executing an inspection; measurement means for measuring a reflected reflection signal of the inspection signal; determination means for determining quality of an inspection object part based on the reflection signal measured by the measurement means; and connection means for connecting a plurality of wires in series which become inspection objects when executing the inspection, and for connecting one end of the wires connected in series, the power supply means and the measurement means.SELECTED DRAWING: Figure 2
申请公布号 JP2016128750(A) 申请公布日期 2016.07.14
申请号 JP20150002747 申请日期 2015.01.09
申请人 NIDEC-READ CORP 发明人 YAMASHITA MUNEHIRO
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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