发明名称 |
ADDITIVE C CAPABLE OF CHANGING MICROVIA-FILLING METHOD BY TSV COPPER PLATING, AND ELECTROPLATING SOLUTION CONTAINING SAME |
摘要 |
An additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing same. The additive C contains by mass percentage: 5%-10%, one of polyethylene glycol or polyvinyl alcohol with the molecular weight of 200-100,000, or the mixture with different molecular weight thereof; 0.001%-0.5% isomer of the surfactant which including the alkylphenol polyoxyethylene ether or fatty alcohol-polyoxyethylene ether; and the solvent is water. The electroplating solution containing the additive C could be used for microvia-filling by TSV copper plating, the electroplating current distribution could be adjusted reasonably to realize the smooth transition between the conformal and bottom-up plating, so as to reduce the possibility of the seam or void in the coating, realize the high-speed electroplating, reduce the thickness of the copper layer, reduce the TSV plating duration and the cost of the chemical mechanical polishing (CMP), and significantly improve the production efficiency. |
申请公布号 |
US2016168737(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201314908778 |
申请日期 |
2013.12.10 |
申请人 |
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. |
发明人 |
WANG Su;YU Xianxian;MA Li;LI Yanyan |
分类号 |
C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
1. An additive C capable of changing microvia-filling method by TSV copper plating, wherein, the additive C contains by mass percentage: 5%-10%, one of polyethylene glycol or polyvinyl alcohol with the molecular weight of 200-100,000, or the mixture with different molecular weight thereof; 0.001%-0.5% isomer of the surfactant which including the alkylphenol polyoxyethylene ether or fatty alcohol-polyoxyethylene ether; and the solvent is water. |
地址 |
Shanghai CN |